Features
■ Based on Qualcomm® QRB5165 SoC with Qualcomm® Kryo™ 585 Octa-core CPU and AI Engine delivering up to 15 TOPS
■ Equipped with SMARC 2.1 compatible module specially designed for robotics and AIoT applications requiring long life, high MTBF and strict revision control
■ Includes everything needed to go live in minutes
■ Industrial grade quality and 10 year product availability
■ Supports Ubuntu andYocto OS
Specifications
CORE SYSTEM | SoC | Qualcomm? QRB5165 SoC with Kryo? 585 Octa-core CPU |
NPU | Qualcomm? AI Engine delivering up to 15 TOPS |
Architecture | Arm Cortex-A77 |
Memory | 8GB LPDDR4 |
Storage | 128GB UFS |
IoT Security | TPM 2.0 (optional) / Qualcomm? Secure Processing Unit |
CONNECTIVITY | Wi-Fi | IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN (optional) |
Bluetooth | Bluetooth 5.0 complaint with Bluetooth 2.1+EDR (optional) |
ETHERNET | LAN | 2x GbE |
AUDIO | Codec | WM890 |
VIDEO | GPU Core | Qualcomm? Adreno 650 GPU |
Video Decoding | 1080p60 HEVC, H.265 for decode H.264, VP9, VP8 |
Video Encoding | 1080p60 H.265, H.264 |
Camera | 5x MIPI-CSI (4 data lanes) 1x MIPI-CSI (2 data lanes) |
I/O INTERFACES | 40-pin RPI Expansion Header | GPIO / I2C / PWM / SPI / UART |
| 40-pin Expansion Header | I2C / CAN / SPI / UART |
CONNECTORS | Display | 1x HDMI 2x LVDS |
| Audio | 1x 3.5mm Audio Jack |
| Network | 2x RJ45 |
| USB | 2x USB 3.0 2x USB 2.0 1x Micro USB |
| Buttons | 1x Reset 1x Power |
| SD Card Slot | 1x microSD |
| SIM Card Slot | 1x SIM |
| M.2 Card Slots | 1x M.2 B-key PCIe 1x M.2 E-key PCIe |
POWER | Input | 19V+/-5% DC |
| Connector | DC Jack |
OPERATING SYSTEMS | Standard Support | Ubuntu / Yocto |
MECHANICAL AND ENVIRONMENTAL | Form Factor | SGET SMARC Specifications v2.1 |
| Dimensions | SMARC short size module (82mm x 50mm) |
| Operating Temperature | Standard: 0°C to +60°C Rugged: -20°C to +85°C (optional) |
| Humidity | 5-90% RH operating, non-condensing 5-95% RH storage |
| Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202 F Method 213B, Table 213- I, Condition A Method 214A, Table 214-I, Condition D |
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
Ordering information
I-Pi SMARC RB5 (EU)
I-Pi SMARC development kit based on LEC-RB5 module including
8GB LPDDR4, 128GB UFS, Micro USB cable and EU AC power adapter
I-Pi SMARC RB5 (US)
I-Pi SMARC development kit based on LEC-RB5 module including
8GB LPDDR4, 128GB UFS, Micro USB cable and USAC power adapter